通过新flow E1&E2模块，Vincotech增加了诸多创新功能，例如通过预弯DCB实现的flow封装技术，已经现场验证成功。flow E1&E2封装可与散热器发生良好的热接触。
封装尺寸：
flow E1
高度：12mm
宽度：62mm
深度：34mm
flow E2
高度：12mm
宽度：63mm
深度：58mm
特点：
12mm低感应标准工业封装
凸型基材可实现良好的热接触
紧凑型设计
CTI600封装材料
热机械推拉力释放
预弯DCB可与散热器发生良好的热接触
压接引脚带泄压区
可选相变材料
优势：
与业内其他同类产品相比，热力性能卓越，Rth降低25%，可靠性更高，功率输出更高
新IGBT M7的芯片级多重采购可确保芯片的安全供应
（凸面DCB可与散热器发生良好的热接触）
（翻译校对：Jacky Wu, 责任编辑：Anna Chai）
With the new flow E1&E2 modules Vincotech has added innovated features like the successfully field proven flow package technology with the pre-bent DCB. flow E1&E2 packages have been designed to offer an excellent thermal contact to the heat sink.
Housing dimensions：
flow E1
Height: 12 mm
Width: 62 mm
Depth: 34 mm
flow E2
Height: 12 mm
Width: 63 mm
Depth: 58 mm
Features：
12 mm low-inductive standard industrial package
Convex shaped substrate for superior thermal contact
Compact design
CTI600 housing material
Thermo-mechanical push-and-pull force relief
Pre-bent DCB for excellent thermal contact to heat sink
Press-fit pins with stress-relive zone
Optional Phase-change material
Benefits：
Superior thermal performance with 25% lower Rth compered to competition for higher reliability and higher power output
Multiple source on chip level with the new IGBT M7 enables a secure supply of chips
（Convex DCB for optimal thermal contact to the heat sink）
